PRODUCTS & TECHNOLOGY
Originally based on US existing line of coatings systems and proprietary slot die coating (SDC) technology, APS offers slot die coating systems for R&D, pilot and full production processing.
APS offers this state-of-the-art equipment solution, proven to be extremely stable in a mass production environment to customers worldwide and at a highly competitive price.
APS offers a line of smaller, lower cost slot die coating systems ideal for research and development applications. APS’ line of slot die coaters are small-footprint, lower cost yet very high-performance systems based upon patent, proprietary technology and engineered specifically for use in R&D and pre-production environments. These systems carry a simple yet flexible design, which provides accurate deposition of a wide range of materials for a variety of applications.
α 300R – proprietary slot die coating technology delivered in a small, affordable platform, with short lead times, geared specifically for R&D and pre-production applications. The system is designed for the processing of 150, 200 or 300mm wide substrates with up to 400mm in length and offers a variety of optional features such as material heating, stirring, substrate heating, post coat IR and/or air knife application. This platform is also available for coating round 200 & 300 mm semiconductor type wafer, as well as square or pseudo square PV wafer. APS will also consider designing custom features and for specific applications (it could involve engineering fees and longer lead time).
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Items |
Detail |
|
Substrate size |
200*200mm/300*300mm (Max 370*470mm) |
|
Substrate type |
Glass, CCL, PV Wafer, Semiconductor Wafer, Flexible Film |
| Coating method | Moving-head design |
|
Coating Liquid |
Photo Resist, Color Resist, Polyimide, Release, Bonding, Perovskite, Passivation, PCBM, Anode, Cathode, ETL, HTL, UV resin, Thermal curing resin |
| Options |
Stage heater, Air knife, IR heater, Special vacuum chuck + Mask |
| Integrated Equipment |
VCD, HotPlate |
APS’ high-performance coaters are used in large volume production of Perovskite PV, FPD (LCD, OLED, Micro LED, and Flexible Display), and various Organic and Printed Electronics applications. These systems offers a robust, production-ready platform that generates high yields (>98%), high material utilization (up to 95%) with minimal operating and maintenance costs. These systems are available for processing Gen2 through Gen8 substrate sizes and beyond.
In addition to the base slot die coating technology, APS offers post-coat drying modules including Vacuum Dry (VCD) and Hotplates (HP) often used for initial drying or “soft bake” immediately after coating.
β 600P – These systems are designed for pilot, lower volume production, usually at smaller substrate sizes than the planned mass production systems. These systems will typically still require some level of automation to simulate a full production environment and work out the “quirks” before committing to full, mass production.
Ɣ 1000M – These high-performance coaters are used in large volume production of FPD, PV, FOPLP and various other applications. This system offers a robust, production-ready platform that generates high yields (>98%) with minimal operating and maintenance costs. It is available for processing typical 2400x1200mm substates for Perovskite PV, 510x515 and 600x600mm for FOPLP applications, as well as sizes up to Gen 8.5 substrate sizes and beyond for FPD applications.
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Items |
Detail |
|
Substrate size |
300*300mm – 2400mm*1200mm G2 – G8.6 size (As FPD standard) |
|
Substrate type |
Glass, CCL, PV Wafer |
| Moving head design |
Slot-die coating, Head moving design |
| Coating liquid options |
Photo Resist, Color Resist, Polyimide, Release, Bonding, Perovskite, Passivation, PCBM, Anode, Cathode, ETL, HTL |
|
Integrated Equipment |
VCD, Hot Plate, Chill Plate, Robot Automation |
In addition, to process a wide range of round wafer substrates, as well as larger square substrates now being used for semiconductor packaging. These systems will be offered as a full turnkey process module including substrate cassette load/unload station, coater, wafer aligner, multi-axis wafer handling robots, post-coat process modules such as vacuum dry, hotplate, chill plate, in a fully enclosed HEPA filtered process area.
